Effect of an applied stress on discontinuous precipitation in a Cu-Ag alloy

フォーマット:

論文

責任表示:

Monzen, Ryoichi ; Terazawa, Tadashi ; Watanabe, Chihiro

言語:

英語

出版情報:

Institute of Physics, 2010-01-01

著者名:

• Monzen, Ryoichi
• Terazawa, Tadashi
• Watanabe, Chihiro

掲載情報:

Journal of Physics: Conference Series

ISSN:

1742-6588      

巻:

240

開始ページ:

12167

バージョン:

author

概要:

金沢大学理工研究域機械工学系<br />The effects of an applied tensile stress on the growth rate and morphology of discontinuous precipitation (DP) product have been studied for a Cu-5wt%Ag alloy aged at 300 °C. The DP cell consists of lamellae of … the rod-shaped Ag precipitates and solute-depleted Cu matrix. The tensile stress accelerates the growth of DP cells along both the loading direction (LD) and transverse direction (TD) but the cell growth rate along the TD is faster than that along the LD. Transmission electron microscopy has revealed that the tensile stress is apt to produce the Ag precipitates elongated in a <110> direction nearly perpendicular to the LD in a cell, irrespective of the cell growth direction. The observed morphology of the Ag precipitates and the promotion of the cell growth, namely precipitate growth under tension can be understood through the interaction energy between the external stress and the misfit strains of precipitate. The growth of Ag precipitates toward the direction perpendicular to the LD explains the faster cell growth along the TD. © 2010 IOP Publishing Ltd. 続きを見る

URL:

http://hdl.handle.net/2297/26236