Application of Eddy-Current Testing Technique for High-Density Double-Layer Printed circuit Board Inspection

フォーマット:

論文

責任表示:

Chomsuwan, K. ; Yamada, Sotoshi ; Iwahara, Masayoshi ; Wakiwaka, H. ; Shoji, S.

言語:

英語

出版情報:

Institute of Electrical and Electronics Engineers IEEE, 2005-10-01

著者名:

• Chomsuwan, K.
• Yamada, Sotoshi
• Iwahara, Masayoshi
• Wakiwaka, H.
• Shoji, S.

掲載情報:

IEEE Transactions on Maggetics

ISSN:

0018-9464      

巻:

41

通号:

10

開始ページ:

3619

終了ページ:

3621

バージョン:

publisher

概要:

High-density double-layer printed circuit board (PCB) inspection based on the eddy-current testing (ECT) technique is proposed in this paper. The ECT probe, which consisted of a planar meander exciting coil and spin-valve giant magnetoresistance (SV-GMR) sensor array, is used for this propose. Defects on both the top- and bottom-layer of the high-density double-layer PCB are examined by the ECT technique with scanning over either the top or bottom layer. The … characteristics of the proposed ECT probe for high-density double-layer PCB inspection are studied. The inspection results of the high-density double-layer PCB model verify that applying the ECT technique enables identification of the defects of both the top and bottom layer with one-side scanning. 続きを見る

URL:

http://hdl.handle.net/2297/48328