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論文 |
論文
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細川, 晃 ; 安井, 平司 ; 樋口, 浩司 ; 佐藤, 郁
概要:
This report deals with the grinding heat partition into workpiece for two kinds of fine ceramics-normally sintered silicon carbide (SSC) and normally sintered silicon nitride (SSN)-in wet grinding. Based on a simple model of heat transfer
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in wet grinding in such that some portions of the total grinding energy (=q) is conducted into workpiece as heat (=qw) and part of qw flows into grinding fluid by convection (=qf) through the ground surface in the wheel-work interference zone, the heat partition into workpiece Rw is calculated. The heat partition of SSC is not affected so much by both table speed and wheel depth of cut with water-based grinding fluid. In the case of SSN, on the other hand, Rw increases from approximately 5% to 35% as table speed increases from 0.2 to 15 m/min. At lower table speed below approximately 1 m/min, however, the heat partitions are little influenced by table speed, in which the fragmented finished surface like SSC is dominant. The abrasive-workpiece interaction of SSN is affected by the grinding zone temperature, so that the surface morphology varies with grinding conditions as well as grinding heat partitions under the conventional grinding conditions.
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| 2.
論文 |
論文
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細川, 晃 ; 安井, 平司 ; 永江, 昌義 ; 佐藤, 郁
概要:
This study deals with the post-process measurement of the grinding wheel topography by means of a newly improved image processing system. In this system, grinding wheel is driven by the high-power electric servomotor with a built-in
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rotary encoder so that both grinding operation and consecutive measurement of the individual abrasive grains by the accurate wheel positioning are possible. The contraction/expansion process is useful for the separation of adjacent grains. The dark field microscopy is effective in order to extract monochromatic CBN grains from the lustrous metal bond. This system is applicable to the practical grinding operation with resinoid and metal bonded superabrasive wheels with a good degree of accuracy and efficiency. In grinding normally sintered silicon nitride with the resinoid-bonded diamond wheel at a given grinding condi-tion, this system reveals that cutting-edge ratio decreases rapidly due to the micro-fracture of grain tips at the transient stage just after truing/dressing, and it increases slightly with the promotion of attritious wear under the successive steady state. This phenomena are explained by the fact that abrasive grains are damaged during truing/dressing operation.
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