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山田, 外史 ; 岩原, 正吉
概要:
This paper describes bare printed circuit board (PCB) inspection based on eddy-current testing (ECT) technique with high
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scanning speed. A high-frequency ECT probe composed of a meander coil as an exciting coil and the spin-valve giant magnetoresistance (SV-GMR) sensor was fabricated and is proposed. The ECT probe was designed based on crack inspection over flat surface, especially suitable for microdefect detection on high-density bare PCB. The ECT signal detected by the SV-GMR sensor was acquired by high-speed A/D converter for applying the signal processing based on digital technique. Harmonic analysis based on Fourier transform was used to analyze the ECT signal at fundamental frequency in order to increase inspection speed and this technique allowed the ECT probe to scan bare PCB, with high sampling frequency and with high-spatial resolution inspection. Experimental results verified the possibility and the performance of the proposed PCB inspection system based on ECT technique. © 2007 IEEE.<br />Power Electronics and Drive Systems, 1997. Proceedings., 1997 International Conference on
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| 2.
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山田, 外史 ; 岩原, 正吉
概要:
This paper describes high-speed printed circuit board (PCB) inspection based on eddy-current testing (ECT) technique. The proposed ECT probe consists only of meander exciter coil and multi spin-valve giant magnetoresistance (SV-GMR)
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sensor that it was designed for detection of microcrack on PCB surface. To conduct high-speed scanning, harmonic analysis based on Fourier analysis is applied to acquire ECT signal at fundamental frequency. Signal variation at defect point is enhanced by applied averaging of multisignal obtained from the multi SV-GMR sensor.<br />Special Issue of the Asia-Pacific Symposium on Applied Electromagnetics and Mechanics (APSAEM06)
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Chomsuwan, K. ; Yamada, Sotoshi ; Iwahara, Masayoshi
概要:
This paper describes the improvement on the defect detection performance of printed circuit board (PCB) inspection based on the eddy-current testing (ECT) technique with the multispin-valve giant magnetoresistance (SV-GMR) sensor. To
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obtain the ECT signal in the same scanning line, SV-GMR sensors are mounted on the exciting coil in the same column parallel with the scanning direction. Harmonic analysis based on the Fourier transform is used to analyze the signal from the SV-GMR sensor in order to increase scanning speed. Then signal averaging is applied to the ECT signal in order to improve the signal-to-noise ratio. Experimental results are performed to verify the inspection performance.
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Yamada, Sotoshi ; Chomsuwan, K. ; Fukuda, Y. ; Iwahara, Masayoshi ; Wakiwaka, H. ; Shoji, S.
概要:
This paper proposes an eddy-current testing (ECT) probe composed of a spin-valve giant magnetoresistance (SV-GMR) sensor and a meander coil for the inspection of bare printed circuit board. The SV-GMR sensor serves as a magnetic sensor for
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the ECT probe to sense the variation of the magnetic field distribution occurred on the printed circuit board. The SV-GMR sensor is used specifically to detect the changing magnetic field distribution occurred at the defect point. The characteristics of the proposed probe are discussed in this paper. The comparisons of signal-to-noise ratios obtained from ECT probe with SV-GMR sensor and with solenoid coil verify that the applying of SV-GMR sensor to the ECT probe can improve the PCB inspection results.
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Chomsuwan, K. ; Yamada, Sotoshi ; Iwahara, Masayoshi ; Wakiwaka, H. ; Shoji, S.
概要:
High-density double-layer printed circuit board (PCB) inspection based on the eddy-current testing (ECT) technique is proposed in this paper. The ECT probe, which consisted of a planar meander exciting coil and spin-valve giant
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magnetoresistance (SV-GMR) sensor array, is used for this propose. Defects on both the top- and bottom-layer of the high-density double-layer PCB are examined by the ECT technique with scanning over either the top or bottom layer. The characteristics of the proposed ECT probe for high-density double-layer PCB inspection are studied. The inspection results of the high-density double-layer PCB model verify that applying the ECT technique enables identification of the defects of both the top and bottom layer with one-side scanning.
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| 6.
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論文
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Chomsuwan, K. ; Yamada, Sotoshi ; Iwahara, Masayoshi
概要:
金沢大学環日本海域環境研究センター生体機能計測研究部門<br />This paper describes the improvement on the defect detection performance of printed cir
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cuit board (PCB) inspection based on the eddy-current testing (ECT) technique with the multispin-valve giant magnetoresistance (SV-GMR) sensor. To obtain the ECT signal in the same scanning line, SV-GMR sensors are mounted on the exciting coil in the same column parallel with the scanning direction. Harmonic analysis based on the Fourier transform is used to analyze the signal from the SV-GMR sensor in order to increase scanning speed. Then signal averaging is applied to the ECT signal in order to improve the signal-to-noise ratio. Experimental results are performed to verify the inspection performance. © 2007 IEEE.
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| 7.
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論文
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Chomsuwan, K. ; Yamada, Sotoshi ; Iwahara, Masayoshi
概要:
金沢大学環日本海域環境研究センター生体機能計測研究部門<br />This paper describes bare printed circuit board (PCB) inspection based on eddy-current
…
testing (ECT) technique with high scanning speed. A high-frequency ECT probe composed of a meander coil as an exciting coil and the spin-valve giant magnetoresistance (SV-GMR) sensor was fabricated and is proposed. The ECT probe was designed based on crack inspection over flat surface, especially suitable for microdefect detection on high-density bare PCB. The ECT signal detected by the SV-GMR sensor was acquired by high-speed A/D converter for applying the signal processing based on digital technique. Harmonic analysis based on Fourier transform was used to analyze the ECT signal at fundamental frequency in order to increase inspection speed and this technique allowed the ECT probe to scan bare PCB, with high sampling frequency and with high-spatial resolution inspection. Experimental results verified the possibility and the performance of the proposed PCB inspection system based on ECT technique. © 2007 IEEE.
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| 8.
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論文
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Yamada, Sotoshi ; Chomsuwan, K. ; Fukuda, Y. ; Iwahara, Masayoshi ; Wakiwaka, H. ; Shoji, S.
概要:
金沢大学環日本海域環境研究センター生体機能計測研究部門<br />This paper proposes an eddy-current testing (ECT) probe composed of a spin-valve giant
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magnetoresistance (SV-GMR) sensor and a meander coil for the inspection of bare printed circuit board. The SV-GMR sensor serves as a magnetic sensor for the ECT probe to sense the variation of the magnetic field distribution occurred on the printed circuit board. The SV-GMR sensor is used specifically to detect the changing magnetic field distribution occurred at the defect point. The characteristics of the proposed probe are discussed in this paper. The comparisons of signal-to-noise ratios obtained from ECT probe with SV-GMR sensor and with solenoid coil verify that the applying of SV-GMR sensor to the ECT probe can improve the PCB inspection results.
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