※一部利用できない機能があります
| 1.
論文 |
論文
|
山田, 外史 ; 岩原, 正吉
概要:
This paper describes bare printed circuit board (PCB) inspection based on eddy-current testing (ECT) technique with high
…
scanning speed. A high-frequency ECT probe composed of a meander coil as an exciting coil and the spin-valve giant magnetoresistance (SV-GMR) sensor was fabricated and is proposed. The ECT probe was designed based on crack inspection over flat surface, especially suitable for microdefect detection on high-density bare PCB. The ECT signal detected by the SV-GMR sensor was acquired by high-speed A/D converter for applying the signal processing based on digital technique. Harmonic analysis based on Fourier transform was used to analyze the ECT signal at fundamental frequency in order to increase inspection speed and this technique allowed the ECT probe to scan bare PCB, with high sampling frequency and with high-spatial resolution inspection. Experimental results verified the possibility and the performance of the proposed PCB inspection system based on ECT technique. © 2007 IEEE.<br />Power Electronics and Drive Systems, 1997. Proceedings., 1997 International Conference on
続きを見る
|
||||
| 2.
論文 |
論文
|
Mukhopdhyay, S.C. ; Yamada, Sotoshi ; Iwahara, Masayoshi ; 岩原, 正吉 ; 山田, 外史
概要:
This paper has investigated the possibility of applying nondestructive evaluation technique for finding the defects in electroplated materials. Planar meander and mesh type magnetic sensors have been considered and their relative
…
performance have been compared based on a single criterion that the effective area of the material surface covered by each type of sensor is same.
続きを見る
|
||||
| 3.
論文 |
論文
|
Kacprzak, D. ; Yamada, Sotoshi ; Iwahara, Masayoshi ; 山田, 外史 ; 岩原, 正吉
概要:
This paper presents simulated amplitude and phase characteristics obtained during the inspection of printed circuit board by an eddy-current testing probe. The simulation is based on the "two-components" nature of the output signal.
…
Amplitude and phase characteristics, obtained during the experimental inspection and simulation, are presented.
続きを見る
|
||||
| 4.
論文 |
論文
|
Chomsuwan, K. ; Yamada, Sotoshi ; Iwahara, Masayoshi ; Wakiwaka, H. ; Shoji, S.
概要:
High-density double-layer printed circuit board (PCB) inspection based on the eddy-current testing (ECT) technique is proposed in this paper. The ECT probe, which consisted of a planar meander exciting coil and spin-valve giant
…
magnetoresistance (SV-GMR) sensor array, is used for this propose. Defects on both the top- and bottom-layer of the high-density double-layer PCB are examined by the ECT technique with scanning over either the top or bottom layer. The characteristics of the proposed ECT probe for high-density double-layer PCB inspection are studied. The inspection results of the high-density double-layer PCB model verify that applying the ECT technique enables identification of the defects of both the top and bottom layer with one-side scanning.
続きを見る
|
||||
| 5.
論文 |
論文
|
Chomsuwan, K. ; Yamada, Sotoshi ; Iwahara, Masayoshi
概要:
金沢大学環日本海域環境研究センター生体機能計測研究部門<br />This paper describes bare printed circuit board (PCB) inspection based on eddy-current
…
testing (ECT) technique with high scanning speed. A high-frequency ECT probe composed of a meander coil as an exciting coil and the spin-valve giant magnetoresistance (SV-GMR) sensor was fabricated and is proposed. The ECT probe was designed based on crack inspection over flat surface, especially suitable for microdefect detection on high-density bare PCB. The ECT signal detected by the SV-GMR sensor was acquired by high-speed A/D converter for applying the signal processing based on digital technique. Harmonic analysis based on Fourier transform was used to analyze the ECT signal at fundamental frequency in order to increase inspection speed and this technique allowed the ECT probe to scan bare PCB, with high sampling frequency and with high-spatial resolution inspection. Experimental results verified the possibility and the performance of the proposed PCB inspection system based on ECT technique. © 2007 IEEE.
続きを見る
|
